1. Ultra Thin:
Micro- and nano-scale structures that can be integrated into low profile interventional devices
2. High Performance:
Supporting conventional, state-of-the art CMOS-processed solid state silicon devices, oriented in high-density arrays
3. Stretchable and Conformal:
Decoration of highly stretchable substrates like meshes and balloons, that can reach over 200% stretch while preserving silicon performance
4. Low cost and high yield:
Preserves cost and quality benefits of Moore’s Law-driven semiconductor supply chain