1. Ultra Thin:

Micro- and nano-scale structures that can be integrated into low profile interventional devices

2. High Performance:

Supporting conventional, state-of-the art CMOS-processed solid state silicon devices, oriented in high-density arrays

3. Stretchable and Conformal:

Decoration of highly stretchable substrates like meshes and balloons, that can reach over 200% stretch while preserving silicon performance

4. Low cost and high yield:

Preserves cost and quality benefits of Moore’s Law-driven semiconductor supply chain